○国際会議発表1. Noise Propagation through TSV in Mixed-Signal 3D-IC and Investigation of Liner Interface with Multi-Well Structured TSV,［Hisashi Kino］，Electron Devices Technology and Manufacturing Conference （EDTM） 2019, 2019-03-15, eng, , . ○論文1. Modeling of the Return Current in a Light-Addressable Potentiometric Sensor, T. Yoshinobu, D. Sato, Y. Guo, ○国際会議発表1. Biochemical Sensors Coupled with Multifunctional Fibers for Label-free Imaging in the Brain and Beyond, Y. Guo, S. Handa, C. F. Werner, K. Miyamoto, P. Anikeeva and T. Yoshinobu, 13th Asian Conference on Chemical Sensors （ACCS 2019），20191117, en, 2, . ○国内会議発表Lee,Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka］，Japanese Journal of Applied Physics, 59 （2019-12），pp. SBBA04- . 3. Investigation of the Impact of External Stress on Memory Characteristics by Modifying the Backside of Substrate,［Y. Oh, J. Sim, N. Toan, H. Kino, T. Ono, T. Tanak, Y. Song］，IEEE Transactions on Electron Devices, 66 4 （2019-04），pp. 1741-1746. 4. Development of Eccentric Spin Coating of Polymer Liner for Low-Temperature TSV Technology With Ultra-Fine Diameter,［Miao Xiong, Zhiming Chen, Yingtao Ding, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka］，IEEE Electron Device Letters, 40 1 （2019-01），pp. 95-98. 2. Low-Viscosity Underfill Technology with Negative CTE Filler for High-Density 3D Interconnections, ［Hisashi Kino］，International Interconnect Technology Conference （IITC） 2019, 2019-06-04, eng, , . 3. Local Bending Stress Suppression with Negative-CTE Material for High Performance 3D IC，［Hisashi Kino］，NANO KOREA 2019 Symposium, 2019-07-04, eng，，．招待講演4. Spike Timing Dependent Plasticity Characteristics of Tunnel FET based MONOS Memory for Low Power Neural Network Circuits，［Hisashi Kino］，2019 International Conference on Solid State Devices and Materials, 2019-09-04, eng, , .5. Investigation of the Underfill with Negative-Thermal-Expansion Material toSuppress Mechanical Stress in 3D Integration System，［Hisashi Kino］，IEEE International 3D Systems Integration Conference 2019 （3DIC 2019），2019-10-09, eng, , . 6. Development of underfill with negative-CTE material for high-reliable three-dimensional integrated circuit （3D IC），［Hisashi Kino］，3rd International Symposium on Negative Thermal Expansion and Related Materials （ISNTE-3），2019-12-11, eng，，．招待講演C. F. Werner and K. Miyamoto, Sensors, 19 4566 （20190900），pp. -. 2. Multimodal fibers and sensors for biological applications，郭 媛元，Institution Seminar, Institute of Nano- and Biotechnologies （INB），Aachen University of Applied Sciences, J?lich, Germany, 20191104, en, 0，．招待講演―67―郭 媛元 助教 ［デバイス・テクノロジー］
元のページ ../index.html#69