東北大学
学際科学フロンティア研究所

新領域創成研究部

在職期間:2017.6-2017.12

Pierre Antoine GeslinPierre Antoine Geslin

助教物質材料・エネルギー

メンター教員(当時)
教授
加藤 秀実(金属材料研究所)
研究分野 material sciences, physical metallurg late but, please, find attached the introduction formy
主な研究テーマ
  • microstructure formation during liquid metal dealloying
  • Coarsening of connected structure from by liquid metal dealloying
  • Phase-field modelling
所属学会  
研究概要  

Liquid Metal Dealloying (LMD) is a new elaboration technique allowing to produce finely structured and porous materials with a sub-micron length-scale (see Fig. 1.a and 1.b). The applications of these new materials require to control the properties of the nano/microstructure, in particular its topology (connected or not) and the size of the ligaments. Experiments show that these properties are primarily controlled by the formation mechanism at the dealloying front but are also affected by the coarsening mechanism of the connected microstructure occurring during the process. In order to improve the microstructures obtained from LMD, a precise understanding of the physical processes involved of these mechanisms is required. My research consists in developing numerical models in synergy with experiments and curring-edge characterization techniques such as X-ray tomograpghy (see Fig. 1.c) to improve our understanding of the LMD process. In particular, I am developping phase-field models (see Fig.1.d), numerical tools especially suited to investigate free-boundary problems involving complex topology changes encountered in this fabrication technique. More precisely, we will focus on the formation mechanism occurring at the dealloying front and the following coarsening behavior leading to a significant increase of the structure length-scale.

Fig 1: (a) sub-microstructured composite obtained after LMD process. (b) sub-microporous structure obtained after chemical removal of one of the phases. (c) Tomographic observation of the porous connected structure. (d) Phase-field modeling of the first steps of the LMD process.

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