○国際会議発表1. Deconvolution-Based Super-Resolution Photoacoustic Microscopy for Visualizing the Internal Structure of Cells, Ryo Shintate, Ryo Nagaoka, Takuro Ishii, Yoshifumi Saijo, 2020 IEEE International Ultrasonics Symposium，2020年9月8日，eng.○国内会議発表1. 超音波排尿流イメージングによる尿道の排尿機能評価に向けた取り組み，石井琢郎，Hassan Nahas, ○論文1. Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration, Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Japanese Journal of Applied Physics, 59 SB （2020年2月1日），pp. 17. 1. A Deep Learning Approach to Resolve Aliasing Artifacts in Ultrasound Color Flow Imaging, Hassan Nahas, Jason S. Au, Takuro Ishii, Billy Y. S. Yiu, Adrian J, Y. Chee, Alfred C. H. Yu, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 67 12 （2020年6月），pp. 2615-2628.2. Contrast-Enhanced Urodynamic Vector Projectile Imaging （CE-UroVPI） for Urethral Voiding Visualization: Principles and Phantom Studies, Takuro Ishii, Hassan Nahas, Billy Y. S. Yiu, Adrian J. Y. Chee, Alfred C. H. Yu, Urology, 140 （2020年）， pp. 171-177. 2. An Overlapped Electrical Scanning Configuration of a 2D Matrix Array Transducer for 3D Vector Flow Imaging Using a Single 256-ch US Platform, Naoya Kanno, Takuro Ishii, Yoshifumi Saijo, 2020 IEEE International Ultrasonics Symposium，2020年9月8日，eng.3. The Hybrid Optical and Photoacoustic Microscopy: a Novel System to Image Morphological and Photoacoustic Characteristics of Cells, Ryo Shintate, Ryo Nagaoka, Takuro Ishii, Yoshifumi Saijo, 2020 IEEE International Ultrasonics Symposium，2020年9月8日，eng.Alfred Yu，日本超音波医学会第93回学術集会，2020年12月1日，jpn.2. Symmetric and asymmetric spike-timing-dependent plasticity function realized in a tunnel-field-effect-transistor-based charge-trapping memory, Hisashi Kino, Takafumi Fukusima, Tetsu Tanaka, Japanese Journal of Applied Physics, 59 SG （2020年4月），pp. -. 3. Development of Non-Volatile Tunnel-FET Memory as a Synaptic Device for Low-Power Spiking Neural Networks, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, 4th Electron Devices Technology and Manufacturing Conference, EDTM 2020- Proceedings, （2020年4月），pp. -.4. Significant Die-Shift Reduction and μ lED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics, Takafumi Fukushima, Yuki Susumago, Zhengyang Qian, Chidai Shima, Bang Du, Noriyuki Takahashi, Shuta Nagata, Tomo Odashima, Hisashi Kino, Tetsu Tanaka, IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 8 （2020年8月），pp. 1419-1422. 5. Generation of STDP with non-volatile tunnel-FET memory for large-scale and low-power spiking neural networks, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, IEEE Journal of the Electron Devices Society, 8 （2020年）， pp. 1266-1271.―68―木野 久志 助教 ［デバイス・テクノロジー］
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