○国際会議発表1. Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD, M. Murugesan, Y. Susumago, T. Odashima, H. Kino, T. Tanaka, K. Sumitani, Y. Imai, S. Kimura, and T. Fukushima, Solid State Devices and Materials，2020年9月29日， eng.6. On-wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through-silicon via applications: Comparison to plasma-enhanced chemical vapor deposition SiO2, Takafumi Fukushima, Mariappan Murugesan, Ji Cheol Bea, Hiroyuki Hashimoto, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Journal of Polymer Science, 58 16 （2020年8月15日），pp. 2248-2258. 7. 7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration, Yuki Miwa, Kousei Kumahara, Sungho Lee, Rui Liang, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Proceedings-Electronic Components and Technology Conference, 2020-June （2020年6月），pp. 1453-1458.8. RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel, Noriyuki Takahashi, Yuki Susumago, Sungho Lee, Yuki Miwa, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima, Proceedings-Electronic Components and Technology Conference, 2020-June （2020年6月），pp. 811-816. 9. Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion, Kousei Kumahara, Rui Liang, Sungho Lee, Yuki Miwa, Mariappan Murugesan, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Proceedings-Electronic Components and Technology Conference, 2020-June （2020年6月）， pp. 1199-1204.2. Micro-LED and PPG Sensor Integration Using Flexible Fan-Out Wafer-Level Packaging for Trans-Nail Pulse-Wave / SpO2 Monitoring, Tomo Odashima, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Shuta Nagata, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima, Solid State Devices and Materials，2020年9月29日，eng. 3. Fabrication and Evaluation of Neural Recording Microelectrode on Opto-Neural Probe with Upconversion Nanoparticles Light Emitter, Fen Yang, Shota Urayama, Haruki Nagasaki, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Solid State Devices and Materials，2020年9月30日， eng.4. Development of Optical Waveguiding Neural Probe with Upconversion-Nanoparticle Light Emitter for Optogenetics, Shota Urayama, Fen Yang, Haruki Nagasaki, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Solid State Devices and Materials， 2020年9月30日， eng.5. Evaluation of the Dopant Effects of ZnO-based Transparent Electrode on Electrochemical Characteristics for Biomedical Applications with Optical Devices, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Solid State Devices and Materials，2020年9月30日，eng.6. Development of Manganese Nitride Wiring with High Thermal Stability Caused by Saturation of the Mean Free Path, Hisashi Kino, Aoba Onishi, Takafumi Fukushima, TetsuTanaka, Solid State Devices and Materials, 2020年9月28日，eng.7. Die-Level Cu-CMP Technology in Via-Last TSV Process for Multichip-to-Wafer 3D integration, Shuai Liu, Kousei Kumahara, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka, Solid State Devices and Materials，2020年9月29日， eng.―69―
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