第80回応用物理学会秋季学術講演会，20190918, ja, 1，札幌．―40―○国内会議発表1. 原子拡散接合法による室温接合技術と接合面の表面粗さ，島津武仁，第4回AFM&CSIソリューションセミナー，20191120, ja, 1，川崎．招待講演2019）， 20190623, en, 2, Prague．招待講演3. Temporary SiC-SiC wafer bonding compatible with high temperature annealing, Fengwen Mu, Tadatomo Suga, Miyuki Uomoto, Takehito Shimatsu, The 69th IEEE Electronic Components and Technology Conference（ECTC 2019），20190528, en, 2, Las Vegas. 4. SiC-SiC temporary bonding compatible with rapid thermal annealing at 1000℃， Fengwen Mu, Tadatomo Suga, Miyuki Uomoto, Takehito Shimatsu, Kenichi Iguchi, Haruo Nakazawa, WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration（LTB-3D 2019），20190521, en, 2，金沢． 5. Novel Gratings for Astronomical Observations Fabricated by Latest Technologies, N. Ebizuka, T. Okamoto, M. Sasaki, I. Tanaka, M. Uomoto and T. Shimatsu, WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration（LTB-3D 2019）， 20190521, en, 2，金沢．6. Rearrangement of Crystal Lattice Occurred at Ag/Ag Bonded Interface in Atomic Diffusion Bonding, S. Matsuda, M. Uomoto, A. Miura, and T. Shimatsu, WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration（LTB-3D 2019），20190521, en, 2，金沢．7. Atomic Diffusion Bonding of Wafers using a-Ge Films with Extremely Low Electrical Conductivity, A. Muraoka, M. Uomoto, M. Abe, and T. Shimatsu, WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration（LTB-3D 2019），20190521, en, 2，金沢．8. Atomic Diffusion Bonding of Wafers Using Thin Nb Films, M. Uomoto and T. Shimatsu, WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration（LTB-3D 2019），20190521, en, 2，金沢．9. Novel Sputter Film Deposition to Fabricate Thick Films with Extremely Smooth Surface Suitable for Room Temperature Bonding, T. Saito, H. Makita, T. Moriwaki, Y. Suzuki, N. Kato, S. Wakayanagi, A. Miura, M. Uomoto and T. Shimatsu, WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration（LTB-3D 2019），20190521, en, 2，金沢． 10. Oxidation of Bonded Thin Ti Films Using Oxide Underlayers in Atomic Diffusion Bonding Process for Optical Applications, G. Yonezawa, Y. Sato, S. Abe, M. Uomoto and T. Shimatsu, WaferBond 2019 EAST 2019 6th International Workshop on Low Temperature Bonding for 3D Integration（LTB-3D 2019），20190521, en, 2， 金沢．11. Atomic Diffusion Bonding: Room Temperature Bonding of Wafers for Creating the Future of Electronic and Optical Devices, Takehito Shimatsu, 3D & SYSTEMS SUMMIT, 20190128, en, 2，ドイツ．招待講演2. CoCrPtグラニュラ薄膜における粒子間交換結合のマイクロ波アシスト磁化反転への影響，佐藤勝成，菊池伸明，岡本 聡，北上 修，島津武仁，第43回日本磁気学会学術講演会，20190925, ja, 1，京都．3. 原子拡散接合によるGaN-on-GaN HEMT高放熱特性，岡本直哉，美濃浦優一，魚本 幸，島津武仁，
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